Polycrystalline XRD Method from Hypernex Finds Metal Defects
January 13, 2004
In an article in Semiconductor International, Alexander E. Braun notes that HyperNex has pursued the development of a quantitative XRD metrology system specifically for fab-level monitoring of polycrystalline phase and texture. The result is a fab system that uses an area detector combined with proprietary wafer motion protocols and XRD analysis algorithms. This combination provides for rapid quantitative phase and texture analysis down to spot sizes as small as 26 ? 35 ?m.
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